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자료유형
학술대회자료
저자정보
윤은상 (충남대학교 고분자공학과) 이기윤 (충남대학교 고분자공학과) 김대수 (충북대학교 화학공학과)
저널정보
한국재료학회 한국재료학회 학술발표대회 한국재료학회 1994년도 추계 학술발표 강연 및 논문 개요집
발행연도
1994.1
수록면
125 - 126 (2page)

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The chemorheological changes and kinetics during curing reaction of an silica filled epoxy system (DGEBA with curing agent Polyxoypropylenediamine) were investigated. This study concentrates on the influence of silica on the reaction kinetics and rheological behavior of the eopxy system. The concentration of the filler was varied 0~200phr. Curing behavior of the silica filled epoxy system was measured at various heating rates with DSC. Conversion was also measured by integrating the obtained DSC curve and Kinetic parameters measured by using the nonlinear regression method. DSC experiments showed that the presence of silica was found to accelerate the progress of the curing reaction and of reduce the heat of reaction compared with that of unfilled epoxy systems . Rheological experiments were conducted on a Physica by using a disposable parallel plate fixture. Material properites were measured such as the elastic modulus(G′), the loss modulus(G"), the loss tangent(tan $\delta$), and the viscosity was at the initial stahe, and the more the silica filler was added, and the lower the gel temperature was in the epoxy system. In this study it is concluded that the curing of the silica filled epoxy system was found to be accelerated, as silica was added to the epoxy compound.

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