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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 한국전기전자재료학회 Transactions on Electrical and Electronic Materials Transactions on Electrical and Electronic Materials 제13권 제6호
- 발행연도
- 2012.1
- 수록면
- 292 - 296 (5page)
이용수
초록· 키워드
오류제보하기
An optimum heat sink for a 30 W chip on board (COB) LED down-light is designed, fabricated, and characterized. By using the SolidWorks Flow simulator and thermal analysis software, the thermal characteristics of the optimum heat sink is analyzed. Four different types of heat sink are simulated and an optimum structure of the heat sink is found.
The simulated temperature of the heat sink when operating the LED down-light is 55.9℃, which is only a difference of 2℃ from the measured temperature. In order to reduce the temperature further, a copper spreader is introduced to the heat sink. The temperature of the heat sink with the copper spreader is 3℃ lower than without the copper spreader.
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등록된 정보가 없습니다.
참고문헌 (9)
참고문헌 신청
ARPACI / 2001 / Introduction to heat transfer : 112 ~
Chun-Jen Weng / 2009 / Advanced thermal enhancement and managementof LED packages / International Communicationsin Heat and Mass Transfer 36 : 3 ~
D. W HONG / 2010 / A Study on High Power LED Lamp Structures 21 (3)
D. W Hong / 2010 / A Study on High Power LED LampStructures 21 : 3 ~
Keum-Yeon / 2011 / COB, COH Package LED Module Thermal AnalysisSimulation 12 : 11 ~
Chun-Jen Weng / 2009 / Advanced thermal enhancement and managementof LED packages / International Communicationsin Heat and Mass Transfer 36 : 3 ~
D. W HONG / 2010 / A Study on High Power LED Lamp Structures 21 (3)
D. W Hong / 2010 / A Study on High Power LED LampStructures 21 : 3 ~
Keum-Yeon / 2011 / COB, COH Package LED Module Thermal AnalysisSimulation 12 : 11 ~
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