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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.1
- 수록면
- 949 - 954 (6page)
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초록· 키워드
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In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 35.㎟ , and were from 17 to 21% at specimen's bonding area above 12㎟ . On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 ㎟ . Inversely, at specimen's bonding area is less then 3.5 ㎟ , mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.
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참고문헌 (8)
참고문헌 신청
JIS Z 3198-6 / 2003 / Translated and Published by Japanese Standards Association
JIS Z 3198-7 / 2003 / Translated and Published by Japanese Standards Association
M. Yunus / 2003 / / Microelectron. Reliab 43 : 2077 ~
S. S. Ha / 2006 / / Journal of Korean Welding Society 24 : 457 ~
W. B. Hampshire / 1993 / The Search for Leadfree Solders / MCB University Press : 49 ~
JIS Z 3198-7 / 2003 / Translated and Published by Japanese Standards Association
M. Yunus / 2003 / / Microelectron. Reliab 43 : 2077 ~
S. S. Ha / 2006 / / Journal of Korean Welding Society 24 : 457 ~
W. B. Hampshire / 1993 / The Search for Leadfree Solders / MCB University Press : 49 ~
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