지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
오류제보하기
In this study, a MEMS microphone that uses Si3N4 as the vibration membrane was produced for application as an auditory device using a sound visualization technique (sound visualization) for the hearing impaired. Two sheets of 6-inch silicon wafer were each fabricated into a vibration membrane and back plate, after which, wafer bonding was performed. A certain amount of charge was created between the bonded vibration membrane and the back plate electrodes, and a MEMS microphone that functioned through the capacitive method that uses change in such charge was fabricated. In order to evaluate the characteristics of the prepared MEMS microphone, the frequency flatness, frequency response, properties of phase between samples, and directivity according to the direction of sound source were analyzed. The MEMS microphone showed excellent flatness per frequency in the audio frequency (100 Hz–10 kHz) and a high response of at least −42 dB (sound pressure level). Further, a stable differential phase between the samples of within −3 dB was observed between 100 Hz–6 kHz. In particular, excellent omnidirectional properties were demonstrated in the frequency range of 125 Hz–4 kHz.
목차
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참고문헌 (18)
참고문헌 신청
B. Jacob / 2008 / Microphone Array Signal Processing / Springer : 185 ~ 189
C. Leinenbach / 2010 / A new capacitive type MEMS microphone / 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems : 659 ~ 662
E. H. Yang / 2001 / A new wafer-level membrane transfer technique for MEMS deformable mirrors / IEEE Conf. on Micro Electro Mechanical Systems : 80 ~ 83
E. M. McMillan / 1946 / Violation of the reciprocity theorem in linear passive electromechanical systems / J. Acoust. Soc. Am. 18 : 344 ~
F. Jiang / 1997 / A flexible MEMS technology and its first application to shear stress sensor skin / Proc. of IEEE workshop. on Micro Electro Mechanical Systems : 465 ~ 470
C. Leinenbach / 2010 / A new capacitive type MEMS microphone / 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems : 659 ~ 662
E. H. Yang / 2001 / A new wafer-level membrane transfer technique for MEMS deformable mirrors / IEEE Conf. on Micro Electro Mechanical Systems : 80 ~ 83
E. M. McMillan / 1946 / Violation of the reciprocity theorem in linear passive electromechanical systems / J. Acoust. Soc. Am. 18 : 344 ~
F. Jiang / 1997 / A flexible MEMS technology and its first application to shear stress sensor skin / Proc. of IEEE workshop. on Micro Electro Mechanical Systems : 465 ~ 470
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