지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
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We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ㎛, a width of 200 ㎛, a thickness of 10 ㎛, and a pitch of 650 ㎛ for 11×11 BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.
목차
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참고문헌 (17)
참고문헌 신청
A. Emerick / 1993 / Enhancement of TSOP solder joint reliability using encapsulation / Proceedings. 43rd Electronic Components and Technology Conference : 187 ~ 192
Benson Chan / 1996 / BGA sockets-A dendritic solution / Proceedings of the Electronic Components & Technology Conference 46 (1) : 460 ~ 466
Bong-Hwan Kim / 2009 / A highly manufacturable large area array MEMS probe card using electroplating and flipchip bonding / IEEE Transactions on Industrial Electronics 56 (4
C. Y. Chung / 1997 / A novel package electrical characterization process-application on plastic BGA packages / Proceedings of the 1st Electronic Packaging Technology Conference : 3
Chanseob Cho / 2011 / Design and fabrication of highly manufacturable MEMS test sockets for BGA IC packages / Japanese Journal of Applied Physics 50 (6)
Benson Chan / 1996 / BGA sockets-A dendritic solution / Proceedings of the Electronic Components & Technology Conference 46 (1) : 460 ~ 466
Bong-Hwan Kim / 2009 / A highly manufacturable large area array MEMS probe card using electroplating and flipchip bonding / IEEE Transactions on Industrial Electronics 56 (4
C. Y. Chung / 1997 / A novel package electrical characterization process-application on plastic BGA packages / Proceedings of the 1st Electronic Packaging Technology Conference : 3
Chanseob Cho / 2011 / Design and fabrication of highly manufacturable MEMS test sockets for BGA IC packages / Japanese Journal of Applied Physics 50 (6)
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