지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2012.1
- 수록면
- 25 - 32 (8page)
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초록· 키워드
오류제보하기
Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.
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참고문헌 (10)
참고문헌 신청
C. Val / 1990 / 3-D Iinterconnection for Ultra-dense Mmultichip Modules / IEEE Trans. on Components, Packaging, and Manufacturing Technology 13 (4) : 814 ~
J. Y. Kim / 2004 / Board Level Reliability Study on Three-Dimensional Thin Stacked Package / Proc. the 54th Annual Electronics Packaging and Components Conference
N. Villegier / / 3D Plus Inc
R. Fillion / 2004 / 3D Electronics Using Vertically Stacked Multichip Slices / Proc. the 3D Technology, Modeling and Process Symposium
R. J. Wojnarowski / 1993 / Three Dimensional Hybrid Wafer Scale Integration Using the GE High Density Interconnect Technology / Proc. the 5th Annual IEEE International Conference o
J. Y. Kim / 2004 / Board Level Reliability Study on Three-Dimensional Thin Stacked Package / Proc. the 54th Annual Electronics Packaging and Components Conference
N. Villegier / / 3D Plus Inc
R. Fillion / 2004 / 3D Electronics Using Vertically Stacked Multichip Slices / Proc. the 3D Technology, Modeling and Process Symposium
R. J. Wojnarowski / 1993 / Three Dimensional Hybrid Wafer Scale Integration Using the GE High Density Interconnect Technology / Proc. the 5th Annual IEEE International Conference o
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