지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2013.1
- 수록면
- 1 - 5 (5page)
이용수
초록· 키워드
오류제보하기
Wafer-to-Wafer (W2W) integration technology is an emerging technology promising many benefits, such as reduced size, improved performance, reduced power, lower cost, and divergent integration. As the maturity of W2W technology progresses, new applications will become more viable. However, at present the cost for W2W integration is still very high and both manufacturing yield and reliability issues have not been resolved yet for high volume manufacturing (HVM). Especially for WTW integration resolving compound yield issue can be a key factor for HVM.
To have the full benefits of WTW integration technology more than simple wafer stacking technologies are necessary.
In this paper, the manufacturing yield for W2W integration is described and the challenges of WTW integration will be discussed.
목차
등록된 정보가 없습니다.
참고문헌 (25)
참고문헌 신청
B. Vaidyanathan / 2009 / Cost-aware lifetime yield analysis of heterogeneous 3D on-chip cache / IEEE Int. MTDT : 65 ~ 70
C. Chou / 2010 / Yield-enhancement techniques for 3D random access memories / IEEE VLSI-DAT : 104 ~ 107
E. Kim / 2008 / Yield challenges in wafer stacking technology / Microelectron. Reliab 48 : 1102 ~ 1105
E. Singh / 2011 / Exploiting rotational symmetries for improved stacked yields in W2W 3D-SICs / IEEE VTS : 32 ~ 37
J. H. Lau / 2010 / manufacturing yield and hidden costs for 3D IC integration / IEEE ECTC : 1031 ~ 1042
C. Chou / 2010 / Yield-enhancement techniques for 3D random access memories / IEEE VLSI-DAT : 104 ~ 107
E. Kim / 2008 / Yield challenges in wafer stacking technology / Microelectron. Reliab 48 : 1102 ~ 1105
E. Singh / 2011 / Exploiting rotational symmetries for improved stacked yields in W2W 3D-SICs / IEEE VTS : 32 ~ 37
J. H. Lau / 2010 / manufacturing yield and hidden costs for 3D IC integration / IEEE ECTC : 1031 ~ 1042
이 논문의 저자 정보
최근 본 자료
댓글(0)
0