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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2013.1
- 수록면
- 33 - 38 (6page)
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초록· 키워드
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In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of nonsymmetric structure with body size of 22.5×22.5 mm, 37.5×37.5 mm and 42.5×42.5 mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.
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참고문헌 (16)
참고문헌 신청
/ / IPC-TM-650 test methods by the manual / Number 2.4.24.4
B. Wang / 2000 / Numerical simulation of interface delamination in electronic packaging / Inter Society Conference on Thermal Phenomena : 400 ~
Chiu Christine / 2007 / Challenges of thin core substrate Flip Chip package on advanced Si Nodes / ECTC '07. Proceedings. 57th : 22 ~
Elva Lin / 2007 / Advantage and challenge of coreless Flip-chip BGA Microsystems / IMPACT : 346 ~
F. Tanaka / 1992 / Viscoelastic properties of physically crosslinked networks (part II) : Dynamic moduli, J. Non-Newt / Fluid Mech 43 (1-2) : 273 ~
B. Wang / 2000 / Numerical simulation of interface delamination in electronic packaging / Inter Society Conference on Thermal Phenomena : 400 ~
Chiu Christine / 2007 / Challenges of thin core substrate Flip Chip package on advanced Si Nodes / ECTC '07. Proceedings. 57th : 22 ~
Elva Lin / 2007 / Advantage and challenge of coreless Flip-chip BGA Microsystems / IMPACT : 346 ~
F. Tanaka / 1992 / Viscoelastic properties of physically crosslinked networks (part II) : Dynamic moduli, J. Non-Newt / Fluid Mech 43 (1-2) : 273 ~
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