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지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.1
- 수록면
- 9 - 17 (9page)
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초록· 키워드
오류제보하기
Nano-composite solders have been studied to improve the properties of Pb-free solder joints. The nanoparticles in the composite solders were carbon nanotubes(CNTs), metals (Ag, Ni, Cr, etc.), ceramics (SiC, ZrO2, TiB2,etc.). To fabricate the nano-composite solders, mechanical mixing methods and in-situ fabrication method has been used for well-dispersed nano phase. The characteristic properties of the nano-composite solders were high creep resistance,low undercooling, low IMC growth rate and fine microstructures. More researches on the nano-composite solders are required to improve the processibility and the reliability of the nano-composite solder joints.
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참고문헌 (25)
참고문헌 신청
C. M. L / 2004 / Properties of lead-free solder alloys with rare earth element additions / Mater. Sci. Eng. R 44 (1) : 1 ~
D. C. Lin / 2003 / An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder / Mater. Sci. Eng. A (360) : 285 ~
D. Lin / 2002 / The influence of copper nanopowders on microstructure and hardness of lead-tin solder / Mater. Lett (53) : 333 ~
D. Lin / 2003 / Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin lead solder / Mater. Lett 57 (21) : 3193 ~
F. Tai / 2005 / Processing and creep properties of Sn.Cu composite solders with small amounts of nanosized Ag reinforcement additions / J. Electron. Mater 34 (11) : 1357 ~
D. C. Lin / 2003 / An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder / Mater. Sci. Eng. A (360) : 285 ~
D. Lin / 2002 / The influence of copper nanopowders on microstructure and hardness of lead-tin solder / Mater. Lett (53) : 333 ~
D. Lin / 2003 / Influence of titanium dioxide nanopowder addition on microstructural development and hardness of tin lead solder / Mater. Lett 57 (21) : 3193 ~
F. Tai / 2005 / Processing and creep properties of Sn.Cu composite solders with small amounts of nanosized Ag reinforcement additions / J. Electron. Mater 34 (11) : 1357 ~
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