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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2012.1
- 수록면
- 343 - 347 (5page)
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In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA,XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.
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참고문헌 (18)
참고문헌 신청
B. K. Park / 2007 / / Thin Solid Films 515 : 7706 ~
C. E. Wilkes / 2005 / PVC Handbook / Hanser Gardner Publications, Inc
D.-Y. Shin / 2009 / / Thin Solid Films 517 : 6112 ~
F. C..Krebs / 2009 / / Sol. Energy Mater. Sol. Cells 93 : 422 ~
J. L. Bolland / 1946 / / Proc. R. Soc. London Ser. A 186 : 218 ~
C. E. Wilkes / 2005 / PVC Handbook / Hanser Gardner Publications, Inc
D.-Y. Shin / 2009 / / Thin Solid Films 517 : 6112 ~
F. C..Krebs / 2009 / / Sol. Energy Mater. Sol. Cells 93 : 422 ~
J. L. Bolland / 1946 / / Proc. R. Soc. London Ser. A 186 : 218 ~
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