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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.1
- 수록면
- 17 - 24 (8page)
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초록· 키워드
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The EAM simulation of nanoindentation was performed to investigate misfit dislocation slip in the Ag/Cu. The film layer, whose thickness in the range of 2-5nm, was indented by a spherical indenter with the Nóse-Hoover thermostat condition. The simulation shows that the indentation position relative to misfit dislocation (MFD) has the effect on the dislocation, glide up or cross slip, for Ag film layer thickness less than 4 nm. Elastic energy variation during MFDs slip was revealed to be a key factor for the softening of Ag/Cu. The critical film layer thickness was evaluated for each case of Ag/Cu according to the spline extrapolation technique.
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참고문헌 (43)
참고문헌 신청
Y. T. Ning / 2007 / Electrical conductivity of Cu-Ag in situ filamentary composites / The Transactions of Nonferrous Metals Society of China 17:378~383
N. W. Ashcroft / 1976 / Solid State Physics / Harcourt College Publishers
H. N. G. Wadley / 2001 / Mechanisms, models and methods of vapour deposition / Progress in Materials Science 46:329
R. A. Johnson / 1989 / Alloy models with the embedded atom method / Physical Review B 39:12554
C. L. Kelchner / 1998 / Dislocation nucleation and defect structure during surface indentation / Physical Review B 58:11085
N. W. Ashcroft / 1976 / Solid State Physics / Harcourt College Publishers
H. N. G. Wadley / 2001 / Mechanisms, models and methods of vapour deposition / Progress in Materials Science 46:329
R. A. Johnson / 1989 / Alloy models with the embedded atom method / Physical Review B 39:12554
C. L. Kelchner / 1998 / Dislocation nucleation and defect structure during surface indentation / Physical Review B 58:11085
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