지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2019.3
- 수록면
- 260 - 267 (8page)
- DOI
- 10.5302/J.ICROS.2019.18.0194
이용수
초록· 키워드
오류제보하기
Surface Mount Technology (SMT) is a manufacturing process in which components are mounted on the surface of a printed circuit board (PCB). The automatic optical inspection system (AOI) has mainly used the learning-based method for the defect classification of the SMT process, and recently the CNN-based classification method has appeared. However, existing techniques do not consider the area margin of the part, so the classification accuracy decreases. In addition, the classification performance of the CNN classifier is degraded due to the uneven color distribution according to the position of the components. In this paper, we propose a system that can extract the component region and improve the color distribution by the input image transformation. We extract the correct component area through vertical and horizontal projection, and the color improvement enhance the brightness value distribution of the component image through local histogram stretching. By experimental result, we prove the performance of the proposed classification method.
목차
Abstract
I. 서론
II. CNN 분류기 기반의 결함 분류 시스템
III. 입력 이미지 변환
IV. 실험 결과
V. 결론
REFERENCES
참고문헌 (21)
참고문헌 신청
H. Xie, Y. Kuang, and X. Zhang, “A high speed AOI algorithm for chip component based on image difference,” IEEE International Conference on Information and Automation 2009, pp. 969-974, Jun. 2009.
H. Wu, G. Feng, H. Li, and X. Zeng, “Automated visual inspection of surface mounted chip components,” International Conference on Mechatronics and Automation, pp. 1789-1794, May. 2010.
F. Wu and X. Zhang, “Feature-extraction-based inspection algorithm for IC solder joints,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 689-694, May. 2011.
N. Cai, J. Lin, Q. Ye, H. Wang, S. Weng, and B. W. K. Ling, “Automatic optical inspection system based on an improved visual background extraction algorithm,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 6, no. 1, pp. 161-172, Jan. 2016.
Q. Ye, N. Cai, J. Li, F. Li, H. Wang, and X. Chen, “IC solder joint inspection based on an adaptive-template method,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 8, no. 6, pp. 1121-1127, Jun. 2018.
H. Wu, G. Feng, H. Li, and X. Zeng, “Automated visual inspection of surface mounted chip components,” International Conference on Mechatronics and Automation, pp. 1789-1794, May. 2010.
F. Wu and X. Zhang, “Feature-extraction-based inspection algorithm for IC solder joints,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 1, no. 5, pp. 689-694, May. 2011.
N. Cai, J. Lin, Q. Ye, H. Wang, S. Weng, and B. W. K. Ling, “Automatic optical inspection system based on an improved visual background extraction algorithm,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 6, no. 1, pp. 161-172, Jan. 2016.
Q. Ye, N. Cai, J. Li, F. Li, H. Wang, and X. Chen, “IC solder joint inspection based on an adaptive-template method,” IEEE Transaction on Component Packaging and Manufacturing Technology, vol. 8, no. 6, pp. 1121-1127, Jun. 2018.
이 논문의 저자 정보
이 논문과 함께 이용한 논문
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2019-003-000504816