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논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 저널정보
- 한국정보통신학회 INTERNATIONAL CONFERENCE ON FUTURE INFORMATION & COMMUNICATION ENGINEERING 2014 INTERNATIONAL CONFERENCE ON FUTURE INFORMATION & COMMUNICATION ENGINEERING Vo.6 No.1
- 발행연도
- 2014.6
- 수록면
- 271 - 278 (8page)
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The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al₂O₃ - SiO₂) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. It was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality.
목차
Abstract
I. INTRODUCTION
II. EXPERIMENTAL PART
III. RESULTS AND DISCUSSIONS
IV. CONCLUSIONS
REFERENCES
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UCI(KEPA) : I410-ECN-0101-2018-004-000962566