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논문 기본 정보

자료유형
학술저널
저자정보
Dong-Min Keum (Hongik University) Shinhyuk Choi (Hongik University) Youngjin Kang (Hongik University) Jae-Gil Lee (Hongik University) Ho-Young Cha (Hongik University) Hyungtak Kim (Hongik University)
저널정보
대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.14 No.5
발행연도
2014.10
수록면
682 - 687 (6page)

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초록· 키워드

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We have performed reverse gate bias stress tests on AlGaN/GaN-on-Si Heterostructure FETs (HFETs). The shift of threshold voltage (Vth) and the reduction of on-current were observed from the stressed devices. These changes of the device parameters were not permanent. We investigated the temporary behavior of the stressed devices by analyzing the temperature dependence of the instabilities and TCAD simulation. As the baseline temperature of the electrical stress tests increased, the changes of the Vth and the on-current were decreased. The on-current reduction was caused by the positive shift of the Vth and the increased resistance of the gate-to-source and the gate-to?drain access region. Our experimental results suggest that electrontrapping effect into the shallow traps in devices is the main cause of observed instabilities.

목차

Abstract
I. INTRODUCTION
II. DEVICE STRUCTURE AND FABRICATION
III. RESULTS AND DISCUSSION
IV. CONCLUSION
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UCI(KEPA) : I410-ECN-0101-2015-560-002808424