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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 저널정보
- 대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.14 No.5
- 발행연도
- 2014.10
- 수록면
- 632 - 639 (8page)
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초록· 키워드
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Mechanical stress and the vacuum level are the two main factors dominating the quality factor of a resonator operated in the vacuum range 1 mTorr to 10 Torr. This means that if the quality factor of a resonator is very insensitive to the mechanical stress in the vacuum range, it is sensitive to mainly the ambient vacuum level. In this paper, a wafer-level packaged MEMS resonator with a highly vacuumsensitive quality factor is presented. The proposed device is characterized by a package with out-of-plane symmetry and a suspending structure with only a single anchor. Out-of-plane symmetry helps prevent deformation of the packaged device due to thermal mismatch, and a single-clamped structure facilitates constraint-free displacement. As a result, the proposed device is very insensitive to mechanical stress and is sensitive to mainly the ambient vacuum level. The average quality factors of the devices packaged under pressures of 50, 100, and 200 mTorr were 4987, 3415, and 2127, respectively. The results demonstrated the high controllability of the quality factor by vacuum adjustment. The mechanical robustness of the quality factor was confirmed by comparing the quality factors before and after hightemperature storage. Furthermore, through more than 50 days of monitoring, the stability of the quality factor was also certified.
목차
Abstract
I. INTRODUCTION
II. DESIGN OF WAFER-LEVEL PACKAGED MEMS RESONATORS
III. FABRICATION PROCESS
IV. QUALITY FACTOR MEASUREMENT
V. RESULTS AND DISCUSSION
VI. CONCLUSION
REFERENCES
참고문헌 (13)
참고문헌 신청
1. [학술지(정기간행물)] - A. Bosseboeufet / 2006 / Vacuum measurement in wafer level encapsulations by interference microscopy / Microsystem technologies 12 (10-11) : 1063 ~ 1069
2. [학술지(정기간행물)] - F. Santagata / 2012 / Tube-shaped Pirani gauge for in situ hermeticity monitoring of SiN thin-film encapsulation / J. Micromech. Microeng. 22 (10) : 25 ~ 32
3. [학술지(정기간행물)] - Y. T. Cheng / 2002 / Vacuum packaging technology using localized aluminum/silicon-to-glass bonding / Journal of Microelectromechanical Systems 11 (5) : 556 ~ 565
4. [학술지(정기간행물)] - S. Hutcherson / 2004 / On the squeeze-film damping of micro-resonators in the free-molecule regime / J. Micromech. Microeng. 14 (12) : 1726 ~ 1733
5. [학술지(정기간행물)] - A. K. Pandey / 2007 / Effect of pressure on fluid damping in MEMS torsional resonators with flow ranging from continuum to molecular regime / Experimental Mechanics 48 : 91 ~ 106
2. [학술지(정기간행물)] - F. Santagata / 2012 / Tube-shaped Pirani gauge for in situ hermeticity monitoring of SiN thin-film encapsulation / J. Micromech. Microeng. 22 (10) : 25 ~ 32
3. [학술지(정기간행물)] - Y. T. Cheng / 2002 / Vacuum packaging technology using localized aluminum/silicon-to-glass bonding / Journal of Microelectromechanical Systems 11 (5) : 556 ~ 565
4. [학술지(정기간행물)] - S. Hutcherson / 2004 / On the squeeze-film damping of micro-resonators in the free-molecule regime / J. Micromech. Microeng. 14 (12) : 1726 ~ 1733
5. [학술지(정기간행물)] - A. K. Pandey / 2007 / Effect of pressure on fluid damping in MEMS torsional resonators with flow ranging from continuum to molecular regime / Experimental Mechanics 48 : 91 ~ 106
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UCI(KEPA) : I410-ECN-0101-2015-560-002808368