We demonstrated an extremely easy and cost-effective nanochnnel fabrication method based on hot embossing process and polyethylene glycol (PEG) mediated bonding method. Master mold for hot embossing process was fabricated on silicon wafer using negative electron beam lithography and reactive ion etching process. Nanogroove array were patterned in a small piece of poly(methyl methacrylate) (PMMA) plate using hot embossing process and were covered by bonding with 170um thick microscope coverslip. Before nanogrooves were sealed with coverslip, nanopatterned PMMA plate was coated with monolayer of polyethylene glycol and exposed to oxygen plasma. Hot embossing conditions such as force, temperature, and pressing time were optimized at 0.92N, 125±2°C and 30 min. Using our method, nanochannels of four different dimensions (200(h) × 400(w), 200(h) × 200(w), 100(h) × 100(w), 100(h) × 70(w)) were fabricated and the dimension of each nanochannel was examined using atomic force microscopy. Also PEG mediated bonding showed excellent water tight performance.