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논문 기본 정보

자료유형
학술저널
저자정보
Sung-Kwen Oh (Chungnam National University) Hong-Sik Shin (Chungnam National University) Kwang-Seok Jeong (Chungnam National University) Meng Li (Chungnam National University) Horyeong Lee (Chungnam National University) Kyumin Han (Chungnam National University) Yongwoo Lee (DMS Co.) Ga-Won Lee (Chungnam National University) Hi-Deok Lee (Chungnam National University)
저널정보
대한전자공학회 JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE Journal of Semiconductor Technology and Science Vol.13 No.6
발행연도
2013.12
수록면
581 - 588 (8page)

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초록· 키워드

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This paper presents a study of the process temperature dependence of Al₂O₃ film grown by thermal atomic layer deposition (ALD) as a passivation layer in the crystalline Si (c-Si) solar cells. The deposition rate of Al₂O₃ film maintained almost the same until 250 ℃, but decreased from 300 ℃. Al₂O₃ film deposited at 250 ℃ was found to have the highest negative fixed oxide charge density (Qf) due to its O-rich condition and low hydroxyl group (-OH) density. After post-metallization annealing (PMA), Al₂O₃ film deposited at 250 ℃ had the lowest slow and fast interface trap density. Actually, Al₂O₃ film deposited at 250 ℃ showed the best passivation effects, that is, the highest excess carrier lifetime (τPCD) and lowest surface recombination velocity (Seff) than other conditions. Therefore, Al₂O₃ film deposited at 250 ℃ exhibited excellent chemical and field-effect passivation properties for p-type c-Si solar cells.

목차

Abstract
I. INTRODUCTION
II. EXPERIMENTAL
III. RESULTS AND DISCUSSIONS
V. CONCLUSIONS
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