지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2013.10
- 수록면
- 59 - 63 (5page)
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초록· 키워드
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A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker’s test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.
목차
Abstract
1. 서론
2. 실험 방법
3. 결과 및 고찰
4. 결론
Reference
참고문헌 (16)
참고문헌 신청
1. [학술대회논문] - G.H. Wang / 2010 / Active-Device-Embedded of Bendable Electronic Module / 12th International Conference on Electronic Materials and Packaging
4. [학술지(정기간행물)] - S.S. Yoon / 2007 / On Moisture Diffusion Modeling Using Thermal-Moisture Analogy / ASME Journal of Electronic Packaging 129 : 421 ~ 426
5. [학술지(정기간행물)] - C.S. Jang / 2008 / Advanced Thermal-Moisture Analogy Scheme Anisothermal Moisture Diffusion Problem / ASME Journal of Electronic Packaging 130 : 011004.1 ~ 011004.8
6. [학술대회논문] - W.S. Hong / 2010 / Moisture Diffusion Coefficient and Activation Energy of Adhesive Film for Flexible Embedded Electronic Module / 12th International Conference on Electronic Materials and Packaging (EMAP 2010)
7. [학술지(정기간행물)] - T. Ikeda / 2006 / Evaluation of the Delamination in a Flip chip Using Anisotropic Conductive Adhesive Films Under Moisture/reflow Sensitivity Test / IEEE Transactions on Components and Packaging Technologies 29 (3) : 551 ~ 559
4. [학술지(정기간행물)] - S.S. Yoon / 2007 / On Moisture Diffusion Modeling Using Thermal-Moisture Analogy / ASME Journal of Electronic Packaging 129 : 421 ~ 426
5. [학술지(정기간행물)] - C.S. Jang / 2008 / Advanced Thermal-Moisture Analogy Scheme Anisothermal Moisture Diffusion Problem / ASME Journal of Electronic Packaging 130 : 011004.1 ~ 011004.8
6. [학술대회논문] - W.S. Hong / 2010 / Moisture Diffusion Coefficient and Activation Energy of Adhesive Film for Flexible Embedded Electronic Module / 12th International Conference on Electronic Materials and Packaging (EMAP 2010)
7. [학술지(정기간행물)] - T. Ikeda / 2006 / Evaluation of the Delamination in a Flip chip Using Anisotropic Conductive Adhesive Films Under Moisture/reflow Sensitivity Test / IEEE Transactions on Components and Packaging Technologies 29 (3) : 551 ~ 559
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UCI(KEPA) : I410-ECN-0101-2014-580-002724358