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학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2013.11
- 수록면
- 960 - 967 (8page)
이용수
초록· 키워드
오류제보하기
Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as“iso-slope contours” in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.
목차
Abstract
Ⅰ. 서론
Ⅱ. 링 조명과 하이브리드 반사 모델
Ⅲ. 3차원 형상 인식을 위한 높이 계산
Ⅳ. 실험 및 토의
Ⅴ. 결론
REFERENCES
참고문헌 (17)
참고문헌 신청
1. [학술대회논문] - David McCann / 2012 / Advanced Packaging and Progress in 3D Integration / The ConFab 2012 Conference
2. [학술지(정기간행물)] - J. H. Kim / 1996 / Pattern classification of solder joint images using a correlation neural network / Engineering Applications of Artificial Intelligence 9 (6) : 655 ~ 669
3. [학술지(정기간행물)] - K. W. Ko / 2000 / Solder joint inspection using a neural network and fuzzy rule-based classification method / Journal of control robotics and Systems 8 (6) : 710 ~ 718
4. [학술지(정기간행물)] - J. H. Kim / 1995 / Neural network-based inspection of solder joints using a circular illumination / Image and Vision Computing 13 : 479 ~ 490
5. [학술지(정기간행물)] - E. N Colenman / 1982 / Obtaining 3-dimensional shape of textured ans specular surface using four-source photometry / Computer Vision, Graph, Image Process 18 (4) : 309 ~ 328
2. [학술지(정기간행물)] - J. H. Kim / 1996 / Pattern classification of solder joint images using a correlation neural network / Engineering Applications of Artificial Intelligence 9 (6) : 655 ~ 669
3. [학술지(정기간행물)] - K. W. Ko / 2000 / Solder joint inspection using a neural network and fuzzy rule-based classification method / Journal of control robotics and Systems 8 (6) : 710 ~ 718
4. [학술지(정기간행물)] - J. H. Kim / 1995 / Neural network-based inspection of solder joints using a circular illumination / Image and Vision Computing 13 : 479 ~ 490
5. [학술지(정기간행물)] - E. N Colenman / 1982 / Obtaining 3-dimensional shape of textured ans specular surface using four-source photometry / Computer Vision, Graph, Image Process 18 (4) : 309 ~ 328
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UCI(KEPA) : I410-ECN-0101-2014-560-002737480