지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
초록· 키워드
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Low-Temperature-cofired ceramics (LTCC) antenna packages have been extensively researched and utilized in recent years due to its excellent electrical properties and ease of implementing dense package integration topologies. This paper introduces some of the key research and development activities using LTCC packaging solutions for 60 ㎓ antennas at Samsung Electronics. The LTCC 60 ㎓ antenna element topology is presented and its measured results are illustrated. However, despite its excellent performance, the high cost issues incurred with LTCC at millimeter wave (mmWave) frequencies for antenna packages remains one of the key impediments to mass market commercialization of mmWave antennas. To address this matter, for the first time to the author’s best knowledge this paper alleviates the high cost of mmWave antenna packaging by devising a novel, broadband antenna package that is wholly based on low-cost, high volume FR4 Printed Circuit Board (PCB). The electrical properties of the FR4 substrate are first characterized to examine its feasibility at 60 GHz. Afterwards a compact multi-layer antenna package which exhibits more than 9 ㎓ measured bandwidth (S11≤-10 ㏈) from 57～66 ㎓ is devised. The measured normalized far-field radiation patterns and radiation efficiency are also presented and discussed.
목차
Abstract
Ⅰ. Introduction
Ⅱ. mmWave LTCC Antenna Package Solution
Ⅲ. mmWave FR-4 Antenna Package Solution
Ⅳ. Conclusions
References
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UCI(KEPA) : I410-ECN-0101-2014-420-003071259