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논문 기본 정보

자료유형
학술대회자료
저자정보
윤종혁 (서강대학교) 허남건 (서강대학교) 배아현 (삼성전자) 이태희 (삼성전자) 송보미나 (삼성전자)
저널정보
대한기계학회 대한기계학회 춘추학술대회 대한기계학회 2012년도 추계학술대회 논문집
발행연도
2012.11
수록면
1,273 - 1,279 (7page)

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Recently, in-mold decoration (IMD) process is one of the popular manufacturing methods to produce exterior plastic parts. IMD process is widely utilized and expanded whole industry owing to proceeding injection molding process and film forming process simultaneously. In the IMD process, rheological resin is directly injected behind film surface with high temperature and pressure conditions, and then local deformation characteristics such as thickness variation, stress and temperature distribution arise on film surface. To predict this local deformation, it is necessary to analyze the IMD process by linking between injection molding process and film forming process. In the present study, to predict this local deformation on film surface, the methodology of connecting CAE analysis was proposed between the film forming analysis and the injection molding analysis. First, injection molding analysis was carried out by using finite element method, and then shape of resin injected at each time step was depicted as a punch objective from film deformation analysis. With results of connecting CAE analysis, it was figure out that highest stress was applied to around injection gate and film thickness near the corner of plastic parts has thinned. In conclusion, it was predicted that local deformation characteristics was obtained by the methodology of connecting CAE analysis on film surface of plastic part.

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Abstract
1. 서론
2. 수치해석
3. 수치해석 결과
4. 결론

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UCI(KEPA) : I410-ECN-0101-2014-550-000189677