지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2012.11
- 수록면
- 987 - 992 (6page)
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초록· 키워드
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This paper predicts the fatigue life of fine-pitch ball grid array (FBGA) solder joints in memory modules due to harmonic excitation by the experiments and the finite element method. A global-local modeling technique was used in finite element simulation. A finite element model of the memory module with simplified solder joints was developed as a global model, and the natural frequencies and modes were calculated and verified by experimental modal testing. Displacement variations were calculated from the global model due to vibration excitation using the mode superposition method. A local model with detailed solder joints was developed in order to calculate stress magnitude concentrated on solder joints of the memory module under vibration. Stress versus life (S-N) curve was developed for memory modules under various vibration levels to derive solder material fatigue constants. Then the fatigue life of the memory module was determined by using the Basquin equation and Miner’s rule. It was experimentally verified that predicted fatigue life of the memory module under cumulative damage conditions matches with experimental results with reasonable accuracy.
목차
Abstract
1. Introduction
2. Analysis model
3. S-N curve development for the memory module
4. Sweep sine test with Miner’s rule
5. Conclusion
References
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UCI(KEPA) : I410-ECN-0101-2014-550-000189026