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연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2012.11
- 수록면
- 410 - 414 (5page)
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초록· 키워드
오류제보하기
In this work, the flash light sintering process of the Ag nano-ink was investigated. Ag nano-ink pattern was printed on flexible PET (polyethylene terephthalate) substrate using a gravure printing system. The printed pattern was sintered by applying flash light from a xenon lamp using a in-house flash light sintering system at room temperature and in ambient condition. In order to monitor a few milliseconds light sintering process, whitestone bridge electrical circuit was devised and the changes of the voltage difference of the Ag nano-ink were recorded using an oscilloscope during the sintering process. The changes of sheet resistance were monitored using the devised in-situ monitoring system for various light conditions (e.g. light energy, on-time and off-time duration and pulse numbers). Using the devised in-situ monitoring system, the flash light sintering mechanism was analyzed in step-wise processes in each light pulses (e.g. evaporation of organic binder followed by forming of neck-like junction and its growth, etc.).
Finally, the optimal sintering conditions of Ag nano-pattern were found without any damage on PET substrate and interfacial delamination between the Ag film and PET substrate based on the in-situ monitoring result. It was found that the optimized flash light sintering process could make a lower sheet resistance of the Ag film (0.95 ohm/sq) than that of the thermally sintered Ag film (2.03 ohm/sq).
Finally, the optimal sintering conditions of Ag nano-pattern were found without any damage on PET substrate and interfacial delamination between the Ag film and PET substrate based on the in-situ monitoring result. It was found that the optimized flash light sintering process could make a lower sheet resistance of the Ag film (0.95 ohm/sq) than that of the thermally sintered Ag film (2.03 ohm/sq).
목차
Abstract
1. 서론
2. 실험 방법
3. 결론 및 토의
4. 결론
참고문헌
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UCI(KEPA) : I410-ECN-0101-2014-550-000187724