메뉴 건너뛰기
.. 내서재 .. 알림
소속 기관/학교 인증
인증하면 논문, 학술자료 등을  무료로 열람할 수 있어요.
한국대학교, 누리자동차, 시립도서관 등 나의 기관을 확인해보세요
(국내 대학 90% 이상 구독 중)
로그인 회원가입 고객센터 ENG
주제분류

추천
검색
질문

논문 기본 정보

자료유형
학술저널
저자정보
Kim Hyesook (한국과학기술원) Monk Andrew (University of York)
저널정보
한국디자인학회 Archives of Design Research 디자인학연구 통권 제103호(Vol.25 No.4)
발행연도
2012.11
수록면
185 - 196 (12page)

이용수

표지
📌
연구주제
📖
연구배경
🔬
연구방법
🏆
연구결과
AI에게 요청하기
추천
검색
질문

초록· 키워드

오류제보하기
The design of technology for communicating with loved ones abroad should be based on a real understanding of emotional experiences with regard to separation and communication. This paper describes a component of this work in the form of a probe study concerning how to plan and conduct a method of emotional probing by means of interviews. Nine participants were recruited, all of whom have one or more family members separated by large distances. Two sets of interviews were conducted with the participants at their homes using the emotional probes which incorporated the ‘spirit of oracle cards’, and the concept of a ‘journey with my family where I was very happy’. The qualitative data elicited from these interviews (17hrs and 4min) was examined for text that indicated: (i) emotional feelings towards the family, (ii) comments about the method of communication, and (iii) positive or negative comments on family relationships using content analysis. The results were illustrated and distributed with the three fixes. The most significant number of text sections examined was in association with the ‘emotion’ and ‘relationship’ section (zone: B). We assumed that the text sections coded with the ‘emotion’, ‘relationship’ and ‘technology’ section (zone: A) will result in more emergent codes in the next step. Further analysis of the data is needed to understand more subtle, complex and meaningful themes on emotions.

목차

Abstract
1. Introduction
2. Probe study method
3. Content analysis of Probe study transcripts
4. Discussion and conclusions
Reference

참고문헌 (0)

참고문헌 신청

이 논문의 저자 정보

이 논문과 함께 이용한 논문

최근 본 자료

전체보기

댓글(0)

0

UCI(KEPA) : I410-ECN-0101-2014-658-000813928