지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2011.10
- 수록면
- 1,720 - 1,723 (4page)
이용수
초록· 키워드
오류제보하기
Recently, there are power supply systems for plating using current such as SCR type DC current, IGBT type DC current, SCR type PR current, SCR type reverse pulse current, FET type pulse current, FET type reverse pulse current. But these type power supply system has problems as follows, power supply system using SCR type DC current and IGBT type DC current is difficult to plate the uneven section, power supply system using SCR type PR current and SCR type reverse pulse current is difficult to generate the high frequency pulse generation for printed circuit board plating, power supply system using FET type pulse current and FET type reverse pulse current is difficult to generate high capacity current and has low efficiency of 10%. By generation of duplicated multi pulse with DC current of pulse type applying the pulse width modulation, these problems can be eliminated. In this work, plating system having current control type power supply module using high pulse width control for PCB plating is proposed, which is consisted of power supply module having reverse pulse regulator for supplying the power, controller of plating system adopted the FPGA and digital feedback algorithm, and plating bath for dipping the plating objects. The developed plating system is verified by performance test.
목차
Abstract
1. INTRODUCTION
2. CONFIGURATION OF PLATING SYSTEM
3. DESIGN AND ANUFACTURING OF PLATING SYSTEM
4. EXPERIMENTAL RESULTS
5. CONCLUSIONS
ACKNOWLEDGMENT
REFERENCES
참고문헌 (0)
참고문헌 신청이 논문의 저자 정보
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2014-569-000915583