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논문 기본 정보

자료유형
학술대회자료
저자정보
Steven Y. Liang (Georgia Institute of Technology) Siva Venkatachalam (One Riverfront Plaza) Hyung Wook Park (Ulsan National Institute of Science and Technology)
저널정보
한국생산제조학회 한국생산제조학회 학술발표대회 논문집 Proceedings of the International Conference of Manufacturing Technology Engineers (ICMTE) 2012
발행연도
2012.10
수록면
21 - 24 (4page)

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초록· 키워드

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The roles of crystallography in the integrity of the parts produced in ultraprecision machining and grinding processes have been quantitatively studied. In ultraprecision machining and grinding the tool geometry features and the process parameters are on the same order of magnitude as the grain size; therefore, the material microstructural attributes in the context of grain size, grain boundaries, crystallographic orientation, etc. can be important. For machining, the grain size, having an effect on the material yield stress via the Hall-Petch model, is represented by a log-normal distribution while the effects of grain boundary and orientation have been modeled using the dislocation principles. For grinding, combined consideration of mechanical and thermal effects within a single grit interaction model of material removal in coupling with the topography and material crystallographic effects has been examined to predict the grinding forces. This study aims to provide a clear understanding of the crystallographic effects to allow for the ultimate goals of prediction, planning, optimization, and control of ultraprecision material removal and finishing processes.

목차

1. Introduction
2. Physics-based Model Development and Validation
3. Conclusions
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