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자료유형
학술대회자료
저자정보
남종순 (안동대학교) Md. Alim Iftekhar Rasel (안동대학교) G.Rajesh (계명대학교) 김희동 (안동대학교)
저널정보
한국전산유체공학회 한국전산유체공학회 학술대회논문집 한국전산유체공학회 2012년도 춘계학술대회 논문집
발행연도
2012.5
수록면
479 - 483 (5page)

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Recently, non-contact handling approaches are attracting much attention in the field of semiconductor production processes such as wafer which is handled frequently during repeated loading and unloading. Since the contact handling often leads to damaging and contaminating the products, it is highly desirable to get effective non-contact handling for the improvement of the product quality. Many non-contact methods making use of magnetic, electrostatic, acoustic and pneumatic levitations of a work piece have been proposed to date. A number of investigations are being made on the pneumatic levitation since it is magnetic free with little heat and can be easily applied to any kind of materials. The pneumatic levitation is based upon Bernoulli principle. However, this method is known to consume large gas flow rate which can be the cost rise of products. Moreover, the recent trend of wafer is increasing its size so that more power is required to lift up and transport the wafer. In this case, the gas flow rate should be increased and the compressibility effects of gas may be of practical importance. In the present paper, a computational fluid dynamics method has been used to get insight into the Bernoulli levitation. A circular plate of work piece was employed as a model of wafer. The 3-dimensional compressible Navier-Stokes equations furnished with the SST k-ω turbulence model were solved using a fully implicit finite volume scheme. The gas flow rate, the diameter of work piece and the inlet nozzle and the clearance gap between the work piece and the circular cylinder were varied to investigate the flow characteristics around the work piece. The levitation force was analyzed in terms of the gas flow rate and the clearance gap. It is known that there is an optimal clearance gap for the lifting force and increasing the supply gas flow rate results in a larger lifting force.

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UCI(KEPA) : I410-ECN-0101-2013-422-002848534