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논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2012.2
- 수록면
- 1 - 7 (7page)
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초록· 키워드
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LED package with 4[mm]-height mold was manufactured and the surface temperature was measured directly using both thermocouple and thermal infrared (IR) camera. FVM simulation was conducted to estimate the surface temperature of the same LED package under the same condition, by which the accuracy of the simulation was secured. Then, the effects of the height and thermal conductivity of the mold on the junction temperature of the LED package were investigated by FVM simulation. The results showed that the junction temperature decreased by 10[℃] when the mold height was 3～5[㎜], but the thermal conductivity of the mold didn’t affect the junction temperature significantly.
목차
Abstract
1. 서론
2. 실험방법
3. 실험결과 및 고찰
4. 결론
감사의 글
References
저자소개
참고문헌 (5)
참고문헌 신청
1. [학술지(정기간행물)] - G.W. t Hooft / 1983 / Temperature dependence of interface recombination and radiative recombination in (Al, Ga)As heterostructures / Applied Physics Letters 42 (9) : 813 ~ 815
2. [학술지(정기간행물)] - Chen / 2009 / The performance of compact thermal models for LED package / Thermochimica Acta 488 : 33 ~ 38
3. [학술지(정기간행물)] - J. C. Hsieh / 2011 / Optimization of Thermal Management by Integration of an SCGM, a Finite-Element Method, and an Experiment on a High-Power LED Array / IEEE Transactions on Electron Devices 58 (4) : 1141 ~ 1148
4. [학술지(정기간행물)] - T. Cheng / 2010 / Thermal analysis and optimization of multiple LED packaging based on a general analytical solution / International Journal of Thermal Sciences 49 : 196 ~ 201
5. [학술지(정기간행물)] - Bor Zen Hong / 1997 / Heat Transfer and Nonlinear Thermal Stress Analysis of a Convective Surface Mount Package / IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 20 (2) : 213 ~ 219
2. [학술지(정기간행물)] - Chen / 2009 / The performance of compact thermal models for LED package / Thermochimica Acta 488 : 33 ~ 38
3. [학술지(정기간행물)] - J. C. Hsieh / 2011 / Optimization of Thermal Management by Integration of an SCGM, a Finite-Element Method, and an Experiment on a High-Power LED Array / IEEE Transactions on Electron Devices 58 (4) : 1141 ~ 1148
4. [학술지(정기간행물)] - T. Cheng / 2010 / Thermal analysis and optimization of multiple LED packaging based on a general analytical solution / International Journal of Thermal Sciences 49 : 196 ~ 201
5. [학술지(정기간행물)] - Bor Zen Hong / 1997 / Heat Transfer and Nonlinear Thermal Stress Analysis of a Convective Surface Mount Package / IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A 20 (2) : 213 ~ 219
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