지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술대회자료
- 저자정보
- 발행연도
- 2011.11
- 수록면
- 286 - 289 (4page)
이용수
초록· 키워드
오류제보하기
New three-dimension (3D) readout pixel sensor circuit is proposed in this paper. The readout IC (ROIC) circuit is used in recent uncooled Bolometer infrared (BMIR) image microelectro-mechanical system (MEMS), which can alter Bolometer capacitance instead of traditional resistance value change. Direct infrared light (IR) can focus on Bolometer focal plane array and cause small capacitance variance, which can be detected and read out to reflect infrared image signal. Effective capacitive transimpedance amplifier (CTIA) architecture is used to get infrared image data and reduce system noise. Cascode amplifier (C-AMP) architecture is also used in Bolometer-CTIA circuit instead of common operational amplifier (OPA) circuit for small pixel size and array area reduction. Additional 3D system architecture is also proposed to reduce ROIC circuit size and increase MEMS system processing efficiency. Experimental results prove effective operation function for small capacitance detection and infrared image signal capture. Low noise feature and small chip size are critical improvements in new 3D infrared image MEMS system.
목차
Abstract
I. INTRODUCTION
II. 3D BOLOMETER-MEMS ARCHITECTURE
III. 3D UNCOOLED BOLOMETER CTIA CIRCUIT
IV. 3D BOLOMETER PIXEL CIRCUIT NETWORK
V. CIRCUIT SIMULATION AND RESULTS
VI. CONCLUSION AND FUTURE WORK
ACKNOWLEDGMENT
참고문헌 (0)
참고문헌 신청이 논문의 저자 정보
최근 본 자료
댓글(0)
0
UCI(KEPA) : I410-ECN-0101-2013-569-001474949