지원사업
학술연구/단체지원/교육 등 연구자 활동을 지속하도록 DBpia가 지원하고 있어요.
커뮤니티
연구자들이 자신의 연구와 전문성을 널리 알리고, 새로운 협력의 기회를 만들 수 있는 네트워킹 공간이에요.
논문 기본 정보
- 자료유형
- 학술저널
- 저자정보
- 발행연도
- 2011.10
- 수록면
- 570 - 575 (6page)
이용수
초록· 키워드
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Ultrasonic metal welder is consisted of power supply, transducer, booster, and horn. Precise designing is required since each parts’ shape, length and mass can affect driving frequency and vibration mode.
This paper analyzed Cu sheet deposition characteristics using ultrasonic metal welder and tension tester. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu plates. The Cu sheet welding was done with different amplitude, pressure, and welding time, and its maximum tension was measured with tension tester. Maximum tension of 153.87N was obtained when the pressure was 2.0bar, amplitude was 80%, and welding time was 0.30s. Therefore, excessive welding condition negatively influences maximum tension measurement result.
This paper analyzed Cu sheet deposition characteristics using ultrasonic metal welder and tension tester. A horn suitable for 40,000Hz was attached to the ultrasonic metal welder in order to weld Cu plates. The Cu sheet welding was done with different amplitude, pressure, and welding time, and its maximum tension was measured with tension tester. Maximum tension of 153.87N was obtained when the pressure was 2.0bar, amplitude was 80%, and welding time was 0.30s. Therefore, excessive welding condition negatively influences maximum tension measurement result.
목차
Abstract
1. 서론
2. 유한요소 해석
3. 실험 장치 및 방법
4. 실험 결과
5. 결론
참고문헌
참고문헌 (10)
참고문헌 신청
1. [학술지(정기간행물)] - Elangovan, S. / 2009 / Temperature and Stress Distribution in Ultrasonic Metal Welding-An FEA-based Study / Journal of Materials Processing Technology 209 (3) : 1143 ~ 1150
2. [학술대회논문] - Song, Y. / 2010 / ACF Flip Chip Bonding using Thermosonic / The Korea Society of Mechanical Engineers autumn conference : 141 ~ 142
3. [학술지(정기간행물)] - Lee, C. K. / 2008 / Bonding of Electric Wire by Ultrasonic Welding / Journal of the Korean Society of machine Tool Engineers 9 (4) : 41 ~ 47
4. [학술대회논문] - Furukawa, R. / 2002 / High Pin-count Ultrasonic Flip-chip Bonding and Plasma Cleaning Technology / Proceedings of 9th Annual KGD Workshop
5. [학술대회논문] - Jung, J. P. / 2008 / Ultrasonic Bonding of Electronic Parts / The Korean Welding and Joining Society autumn conference : 7 ~ 9
2. [학술대회논문] - Song, Y. / 2010 / ACF Flip Chip Bonding using Thermosonic / The Korea Society of Mechanical Engineers autumn conference : 141 ~ 142
3. [학술지(정기간행물)] - Lee, C. K. / 2008 / Bonding of Electric Wire by Ultrasonic Welding / Journal of the Korean Society of machine Tool Engineers 9 (4) : 41 ~ 47
4. [학술대회논문] - Furukawa, R. / 2002 / High Pin-count Ultrasonic Flip-chip Bonding and Plasma Cleaning Technology / Proceedings of 9th Annual KGD Workshop
5. [학술대회논문] - Jung, J. P. / 2008 / Ultrasonic Bonding of Electronic Parts / The Korean Welding and Joining Society autumn conference : 7 ~ 9
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UCI(KEPA) : I410-ECN-0101-2013-552-000796136